SMD POWER INDUC...
HNR SERIES HSDI TYPE HBPD TYPE HPC TYPE HCRH TYPE HCRH*D TYPE HCRS TYPE HPBS TYPE HLF TYPE HCD TYPE HCP TYPE HCPS TYPE HBPN/HPBP TYPE HSMI SERIES HSHW/HSFW SERIES HSQH SERIES HTD/HTD*L TYPEPK/PA TYPE
HBT TYPE
HPT TYPE
HME TYPE
HME0711 TYPEHRH TYPE
HRH TYPEHR6H TYPE
TRANSFORMER/FIL...
AI TYPE

![]() |
Wire Wound Chip Inductor
> Wire Wound Chip Inductor
1.High rate current,High Q value .
2.Good resistance to heat and humidity
3.High density mountings > 1.Small chip suitable for mounting
2. High Q value and high self-resontant frequency with ceramic material
3.Tight inductance tolerance and stable inductance at high frequency
...
> 1.High frequency circuit in telecommunication and other equipments
2.Mobile phones such as GSM,CDMA,PDC,etc
3.Bluetooth,W-LAN
...
【 Send a message 】
![]() |
Wire Wound Chip Inductor Features:
1.Small chip suitable for mounting
2. High Q value and high self-resontant frequency with ceramic material
3.Tight inductance tolerance and stable inductance at high frequency
4.30% higher current rating than conventional inductors of equal size
5.Takes up less PCB real estate and save moer power
wire Wound Chip Inductor Applications:
1.High frequency circuit in telecommunication and other equipments
2.Mobile phones such as GSM,CDMA,PDC,etc
3.Bluetooth,W-LAN
4.Notebooks,desktop computer,severs,graphic cards
5.Portable gaming devices.personal navigation systems,persona multimedia devices
6.Automotive systems
7.Telecomm base stations
Wire Wound Chip Inductor standard:
Code | Packaging | Minimum Quantity |
L | 180mm Embossed Tape | 1000 |
Go Back | Print | Close this window