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toroidal core chip inductor HSMI 322522

 
toroidal core chip inductor HSMI 322522

> toroidal core chip inductor 1.High stability and high saturation current 2.Good frequency characteristics 3.low loss and stabled
> wire wound chip inductor materials: 1.core: ferrite DR core 2.wire: enamelled copper wire 3.terminal: tinned copper flat ...
> 1.LED light 2.Next-gerneration mobile devices with multifunction such as adding color TV and digital movie cameras 3.Flat-screen TVs,blue-ray disc recorders,set top box 4.Notebooks,desktop computer,severs,graphic cards 5.Portable gaming devices.personal navigation systems,persona multimedia devices 6.Automotive systems 7.Telecomm base stations



Product Details:

toroidal core chip inductor materials:

1.core: ferrite DR core

2.wire: enamelled copper wire

3.terminal: tinned copper flat

4.Encapsulate: epoxy novolac molding compound

toroidal core chip inductor Features:

1.Magnetic-resin shieded construction reduces buzz noise to ultra-low levels

2.Merallization on Ferrite Core results in excellent shock resistance and damage-free durability

3.Closed magnetic circuit design reduces leakage flux and Electro Magnetic Interference(EMI)

4.30% higher current rating than conventional inductors of equal size

5.Takes up less PCB real estate and save moer power 

toroidal core chip inductor Applications:

1.LED light

2.Next-gerneration mobile devices with multifunction such as adding color TV and digital movie cameras

3.Flat-screen TVs,blue-ray disc recorders,set top box

4.Notebooks,desktop computer,severs,graphic cards

5.Portable gaming devices.personal navigation systems,persona multimedia devices

6.Automotive systems

7.Telecomm base stations

 toroidal core chip inductor standard:

Code Packaging Minimum Quantity
L 180mm Embossed Tape 800

 

Shielded SMD ferrite power inductor

toroidal core chip inductor Specifications:

Temp.rise:20°C max

Ambient temp.: 80°C max

Storage temp.:-40 °C ~+100 °C

Operating temp.:-25 °C ~+100 °C

Terminal strength:0.5kg min

Rated current:

   Current  cause inductance drop whinin 10%

Resistance to solder

   Heat:260 °C  10 secs.

Resistance to solvent: PER MIL-STD-202F



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